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Hygrothermal Stress Analysis of Epoxy Molding Compound in Fan-Out Panel-Level Package Based on Experimental Characterization and Structural Sensitivity.

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Title: Hygrothermal Stress Analysis of Epoxy Molding Compound in Fan-Out Panel-Level Package Based on Experimental Characterization and Structural Sensitivity.
Authors: Sung YC; Department of Mechanical Engineering, National Cheng Kung University, Tainan 70101, Taiwan., Hu CP; Department of Mechanical Engineering, National Cheng Kung University, Tainan 70101, Taiwan., Hwang SJ; Department of Mechanical Engineering, National Cheng Kung University, Tainan 70101, Taiwan., Shih MH; Department of Mechanical Engineering, Southern Taiwan University of Science and Technology, Tainan 710301, Taiwan., Liao WH; Packaging Product Simulation and Design Division, Innolux Corporation, Tainan 744092, Taiwan., Zeng YJ; Packaging Product Simulation and Design Division, Innolux Corporation, Tainan 744092, Taiwan., Tsai CT; Testing Center, Innolux Corporation, Tainan 744092, Taiwan.
Source: Polymers [Polymers (Basel)] 2025 Jul 25; Vol. 17 (15). Date of Electronic Publication: 2025 Jul 25.
Publication Type: Journal Article
Journal Info: Publisher: MDPI Country of Publication: Switzerland NLM ID: 101545357 Publication Model: Electronic Cited Medium: Internet ISSN: 2073-4360 (Electronic) Linking ISSN: 20734360 NLM ISO Abbreviation: Polymers (Basel) Subsets: PubMed not MEDLINE
Database: MEDLINE Ultimate
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PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Hygrothermal Stress Analysis of Epoxy Molding Compound in Fan-Out Panel-Level Package Based on Experimental Characterization and Structural Sensitivity.
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  Data: <searchLink fieldCode="AU" term="%22Sung+YC%22">Sung YC</searchLink>; Department of Mechanical Engineering, National Cheng Kung University, Tainan 70101, Taiwan.<br /><searchLink fieldCode="AU" term="%22Hu+CP%22">Hu CP</searchLink>; Department of Mechanical Engineering, National Cheng Kung University, Tainan 70101, Taiwan.<br /><searchLink fieldCode="AU" term="%22Hwang+SJ%22">Hwang SJ</searchLink>; Department of Mechanical Engineering, National Cheng Kung University, Tainan 70101, Taiwan.<br /><searchLink fieldCode="AU" term="%22Shih+MH%22">Shih MH</searchLink>; Department of Mechanical Engineering, Southern Taiwan University of Science and Technology, Tainan 710301, Taiwan.<br /><searchLink fieldCode="AU" term="%22Liao+WH%22">Liao WH</searchLink>; Packaging Product Simulation and Design Division, Innolux Corporation, Tainan 744092, Taiwan.<br /><searchLink fieldCode="AU" term="%22Zeng+YJ%22">Zeng YJ</searchLink>; Packaging Product Simulation and Design Division, Innolux Corporation, Tainan 744092, Taiwan.<br /><searchLink fieldCode="AU" term="%22Tsai+CT%22">Tsai CT</searchLink>; Testing Center, Innolux Corporation, Tainan 744092, Taiwan.
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  Data: <searchLink fieldCode="JN" term="%22101545357%22">Polymers</searchLink> [Polymers (Basel)] 2025 Jul 25; Vol. 17 (15). <i>Date of Electronic Publication: </i>2025 Jul 25.
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  Data: <i>Publisher: </i><searchLink fieldCode="PB" term="%22MDPI%22">MDPI </searchLink><i>Country of Publication: </i>Switzerland <i>NLM ID: </i>101545357 <i>Publication Model: </i>Electronic <i>Cited Medium: </i>Internet <i>ISSN: </i>2073-4360 (Electronic) <i>Linking ISSN: </i><searchLink fieldCode="IS" term="%2220734360%22">20734360 </searchLink><i>NLM ISO Abbreviation: </i>Polymers (Basel) <i>Subsets: </i>PubMed not MEDLINE
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        Value: 10.3390/polym17152034
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      – Code: eng
        Text: English
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      – TitleFull: Hygrothermal Stress Analysis of Epoxy Molding Compound in Fan-Out Panel-Level Package Based on Experimental Characterization and Structural Sensitivity.
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            NameFull: Hu CP
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              Text: 2025 Jul 25
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              Y: 2025
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              Value: 15
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