Magnetic field-enhanced vertical integration enables embodied intelligence in untethered soft robots.

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Title: Magnetic field-enhanced vertical integration enables embodied intelligence in untethered soft robots.
Authors: Li X; Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen 518055, P. R. China., Xiao X; Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen 518055, P. R. China., Xiao X; Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore.; SIA-NUS Digital Aviation Corporate Laboratory, National University of Singapore, Singapore 117602, Singapore., Liu Z; Department of Materials Science and Engineering, University of California, Los Angeles, Los Angeles, CA 90095, USA., Gong J; Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen 518055, P. R. China., Lin Z; Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen 518055, P. R. China., Xue B; Department of Materials Science and Engineering, National University of Singapore, Singapore 117575, Singapore.; Institute for Health Innovation and Technology, National University of Singapore, Singapore 117599, Singapore., Liu S; Thayer School of Engineering, Dartmouth College, Hanover, NH 03755, USA., Wu X; Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen 518055, P. R. China., Zhang W; Department of Materials Science and Engineering, National University of Singapore, Singapore 117575, Singapore.; Institute for Health Innovation and Technology, National University of Singapore, Singapore 117599, Singapore., Wang D; Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen 518055, P. R. China., Zhao R; Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen 518055, P. R. China., Wang Z; Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen 518055, P. R. China., Zhong X; Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen 518055, P. R. China., Lin Y; Department of Chemical and Biomolecular Engineering, National University of Singapore, Singapore 117585, Singapore., Chia P; Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore., He X; Department of Materials Science and Engineering, University of California, Los Angeles, Los Angeles, CA 90095, USA., Ho JS; Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore.; Institute for Health Innovation and Technology, National University of Singapore, Singapore 117599, Singapore.; The N.1 Institute for Health, National University of Singapore, Singapore 117456, Singapore., Ho GW; Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore.; Department of Materials Science and Engineering, National University of Singapore, Singapore 117575, Singapore., Ouyang W; Thayer School of Engineering, Dartmouth College, Hanover, NH 03755, USA., Ding W; Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen 518055, P. R. China., Zhou G; Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen 518055, P. R. China., Laschi C; Department of Mechanical Engineering, National University of Singapore, Singapore 117575, Singapore.; Advanced Robotics Centre, National University of Singapore, Singapore 117575, Singapore., Wu C; Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore.; SIA-NUS Digital Aviation Corporate Laboratory, National University of Singapore, Singapore 117602, Singapore.; Department of Materials Science and Engineering, National University of Singapore, Singapore 117575, Singapore.; Institute for Health Innovation and Technology, National University of Singapore, Singapore 117599, Singapore.; The N.1 Institute for Health, National University of Singapore, Singapore 117456, Singapore.
Source: Science advances [Sci Adv] 2025 Sep 12; Vol. 11 (37), pp. eadv9572. Date of Electronic Publication: 2025 Sep 10.
Publication Type: Journal Article
Journal Info: Publisher: American Association for the Advancement of Science Country of Publication: United States NLM ID: 101653440 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 2375-2548 (Electronic) Linking ISSN: 23752548 NLM ISO Abbreviation: Sci Adv Subsets: MEDLINE; PubMed not MEDLINE
Database: MEDLINE Ultimate
Description
ISSN:2375-2548
DOI:10.1126/sciadv.adv9572