| Authors: |
Zhao Q; School of Materials Science and Engineering, Zhengzhou Key Laboratory of Flexible Electronic Materials and Thin-Film Technologies, Zhengzhou University, Zhengzhou 450001, China. liuxy@zzu.edu.cn., Liu H; School of Materials Science and Engineering, Zhengzhou Key Laboratory of Flexible Electronic Materials and Thin-Film Technologies, Zhengzhou University, Zhengzhou 450001, China. liuxy@zzu.edu.cn., Liu C; State Key Laboratory of Optoelectronic Materials and Technologies, School of Electronics and Information Technology, Sun Yat-sen University, Guangzhou 510275, P. R. China., Minari T; Printed Electronics Group, Research Center for Functional Materials, National Institute for Materials Science (NIMS), Tsukuba, Ibaraki 305-0044, Japan., Kim SH; School of Chemical Engineering, Konkuk University, Seoul 05029, Korea., Tang X; School of Materials Science and Engineering, Zhengzhou Key Laboratory of Flexible Electronic Materials and Thin-Film Technologies, Zhengzhou University, Zhengzhou 450001, China. liuxy@zzu.edu.cn.; College of Material and Chemical Engineering, Institute of New Energy Science and Technology, School of Future Hydrogen Energy Technology, Zhengzhou University of Light Industry, Zhengzhou 450001, P. R. China., Liu X; School of Materials Science and Engineering, Zhengzhou Key Laboratory of Flexible Electronic Materials and Thin-Film Technologies, Zhengzhou University, Zhengzhou 450001, China. liuxy@zzu.edu.cn. |
