| Authors: |
Labed M; Department of Semiconductor Systems Engineering and Convergence Engineering for Intelligent Drone and Institute of Semiconductor and System IC, Sejong University, Seoul 05006, Republic of Korea.; Institute of Semiconductor and System IC, Sejong University, Seoul 05006, Republic of Korea., Shin K; Department of Semiconductor Systems Engineering and Convergence Engineering for Intelligent Drone and Institute of Semiconductor and System IC, Sejong University, Seoul 05006, Republic of Korea., Shaikh MTAS; Department of Semiconductor Systems Engineering and Convergence Engineering for Intelligent Drone and Institute of Semiconductor and System IC, Sejong University, Seoul 05006, Republic of Korea., Park JH; Department of Semiconductor Systems Engineering and Convergence Engineering for Intelligent Drone and Institute of Semiconductor and System IC, Sejong University, Seoul 05006, Republic of Korea., Cheon YJ; Department of Intelligent Mechatronics Engineering and Convergence Engineering for Intelligent Drone, Sejong University, Seoul 05006, Republic of Korea., Park BI; Department of Semiconductor Science & Technology, Jeonbuk National University, Jeonju 54896, Republic of Korea., Pearton SJ; Department of Materials Science and Engineering, University of Florida, Gainesville, Florida 32611, United States of America., Rim YS; Department of Semiconductor Systems Engineering and Convergence Engineering for Intelligent Drone and Institute of Semiconductor and System IC, Sejong University, Seoul 05006, Republic of Korea.; Institute of Semiconductor and System IC, Sejong University, Seoul 05006, Republic of Korea. |
