| Authors: |
Liu P; School of Naval Architecture, Ocean, Energy and Power Engineering, Wuhan University of Technology, Wuhan, China., Coatsworth P; Communications Engineering, Springer Nature, London, UK., Neto P; University of Coimbra, CEMMPRE, Department of Mechanical Engineering, Coimbra, Portugal., Tian L; Department of Biomedical Engineering, Zhejiang University, Hangzhou, China., de Carvalho Castro E Silva C; Mackenzie Presbyterian University, MackGraphe-Mackenzie Institute for Research in Graphene and Nanotechnologies, São Paulo, Brazil., Huang C; Department of Electronic Engineering, the Chinese University of Hong Kong, Hong Kong SAR, China., Daw R; Communications Engineering, Springer Nature, London, UK. r.daw@nature.com., Elias S; Institute for Risk and Reliability, Leibniz University Hannover, Hannover, Germany., Behnood A; Department of Civil Engineering, University of Mississippi, University, Oxford, MS, USA., Schofield JS; Mechanical and Aerospace Engineering, University of California Davis, Davis, CA, USA., Rizzo A; Dipartimento di Elettronica e Telecomunicazioni, Politecnico di Torino, Torino, Italy., Perlman O; School of Biomedical Engineering and Sagol School of Neuroscience, Tel Aviv University, Tel Aviv, Israel., Raney J; Department of Mechanical Engineering & Applied Mechanics, University of Pennsylvania, Philadelphia, PA, USA., Chen WG; Department of Plastics Engineering, University of Massachusetts Lowell, Lowell, MA, USA., Fujii M; Department of Civil and Environmental Engineering, School of Environment and Society, Institute of Science Tokyo, Tokyo, Japan., Tingley DD; School of Mechanical, Aerospace, and Civil Engineering, University of Sheffield, Sheffield, UK., Wang W; Communications Engineering, Springer Nature, Beijing, China., Mastrangeli M; Department of Microelectronics, Delft University of Technology, Delft, the Netherlands. |
