| Authors: |
Shan J; Department of Mechanical and Automation Engineering, T Stone Robotics Institute, The Chinese University of Hong Kong, Hong Kong; Shenyang Institute of Automation, Chinese Academy of Sciences, Shenyang, China; State Key Laboratory of Robotics and Intelligent Systems, Shenyang, China. Electronic address: jiweishan@link.cuhk.edu.hk., Cai Z; School of Integrated Circuits, Shanghai Jiao Tong University, Shanghai, China., Hsieh CT; School of Automation and Intelligent Sensing, Shanghai Jiao Tong University, Shanghai, China., Li Y; Department of Mechanical and Automation Engineering, T Stone Robotics Institute, The Chinese University of Hong Kong, Hong Kong., Liu H; Shenyang Institute of Automation, Chinese Academy of Sciences, Shenyang, China; State Key Laboratory of Robotics and Intelligent Systems, Shenyang, China., Han L; School of Automation and Intelligent Sensing, Shanghai Jiao Tong University, Shanghai, China. Electronic address: lijun_han@sjtu.edu.cn., Wang H; School of Automation and Intelligent Sensing, Shanghai Jiao Tong University, Shanghai, China; Ministry of Education of China, Key Laboratory of System Control and Information Processing, Shanghai, China., Cheng SS; Department of Mechanical and Automation Engineering, T Stone Robotics Institute, The Chinese University of Hong Kong, Hong Kong. Electronic address: sscheng@cuhk.edu.hk. |
