| Authors: |
Shi R; State Key Laboratory of Metastable Materials Science & Technology and Key Laboratory for Microstructural Material Physics of Hebei Province, School of Science, Yanshan University, Qinhuangdao 066004, China.; Hebei Key Laboratory of Advanced Laser Technology and Equipment, Tianjin 300401, China., Jia S; State Key Laboratory of Metastable Materials Science & Technology and Key Laboratory for Microstructural Material Physics of Hebei Province, School of Science, Yanshan University, Qinhuangdao 066004, China.; Hebei Key Laboratory of Advanced Laser Technology and Equipment, Tianjin 300401, China., Liu X; State Key Laboratory of Metastable Materials Science & Technology and Key Laboratory for Microstructural Material Physics of Hebei Province, School of Science, Yanshan University, Qinhuangdao 066004, China., Gao Z; School of Mathematics and Physics, Bengbu University, Bengbu 233030, China., Feng C; State Key Laboratory of Metastable Materials Science & Technology and Key Laboratory for Microstructural Material Physics of Hebei Province, School of Science, Yanshan University, Qinhuangdao 066004, China., Li S; State Key Laboratory of Metastable Materials Science & Technology and Key Laboratory for Microstructural Material Physics of Hebei Province, School of Science, Yanshan University, Qinhuangdao 066004, China., Chen H; State Key Laboratory of Metastable Materials Science & Technology and Key Laboratory for Microstructural Material Physics of Hebei Province, School of Science, Yanshan University, Qinhuangdao 066004, China.; Hebei Key Laboratory of Advanced Laser Technology and Equipment, Tianjin 300401, China., Shum PP; Department of Electronic and Electrical Engineering, Southern University of Science and Technology, Shenzhen 518055, China. |
