| Authors: |
Lin Y; Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong SAR, China., Sun H; Koln 3D Technology (Medical) Limited, Hong Kong SAR, China., Li Y; Department of Physics, Beihang University, Beijing, China., Aslam R; Koln 3D Technology (Medical) Limited, Hong Kong SAR, China., Tse LF; Union Hospital, Hong Kong SAR, China., Cheng T; Dental Materials Science, Division of Applied Oral Sciences and Community Dental Care, Faculty of Dentistry, The University of Hong Kong, Hong Kong SAR, China., Chui CS; Department of Orthopaedics and Traumatology, The Chinese University of Hong Kong, Hong Kong SAR, China., Yau WF; Koln 3D Technology (Medical) Limited, Hong Kong SAR, China., Le Meur VR; Koln 3D Technology (Medical) Limited, Hong Kong SAR, China., Amangeldy M; Koln 3D Technology (Medical) Limited, Hong Kong SAR, China., Cho K; Dental Materials Science, Division of Applied Oral Sciences and Community Dental Care, Faculty of Dentistry, The University of Hong Kong, Hong Kong SAR, China., Ye Y; Department of Management Science and Engineering, Stanford University, Stanford, CA, USA.; Department of Industrial Engineering and Decision Analytics, The Hong Kong University of Science and Technology, Hong Kong SAR, China., Zou J; Department of Biomedical Data Science, Stanford University, Stanford, CA, USA., Zhao W; Department of Physics, Beihang University, Beijing, China. zhaow20@buaa.edu.cn.; National Key Laboratory of Spintronics, Hangzhou International Innovation Institute, Beihang University, Hangzhou, China. zhaow20@buaa.edu.cn.; Tianmushan Laboratory, Hangzhou, China. zhaow20@buaa.edu.cn., Li X; Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong SAR, China. eexmli@ust.hk. |
