| Authors: |
Zhang L; School of Electronic and Information Engineering, Lanzhou Jiaotong University, Lanzhou, 730070, China. zhanglj_81@tsnu.edu.cn.; School of Electronic and Information, Gansu Industry Polytechnic College, Tianshui, 741025, China. zhanglj_81@tsnu.edu.cn.; Engineering Research Center, Ministry of Education on Integrated Circuit Packaging and Testing, Tianshui, 741001, China. zhanglj_81@tsnu.edu.cn.; School of Electronic Information and Electrical Engineering, Tianshui Normal University, Tianshui, 741001, China. zhanglj_81@tsnu.edu.cn., Wang Y; School of Electronic and Information Engineering, Lanzhou Jiaotong University, Lanzhou, 730070, China., Dang W; Engineering Research Center, Ministry of Education on Integrated Circuit Packaging and Testing, Tianshui, 741001, China.; School of Electronic Information and Electrical Engineering, Tianshui Normal University, Tianshui, 741001, China., Jiang X; School of Information Science and Engineering, Lanzhou Bowen College of Science and Technology, Lanzhou, 730101, China., Yang H; Technology Marketing Center, Huatian Technology (Xi'an) Headquarters Management Co., Ltd., Xi'an, 710018, China. |
