Electronics with switchable flexibility for 3D conforming neural interfaces.

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Title: Electronics with switchable flexibility for 3D conforming neural interfaces.
Authors: He X; Department of Biomedical Engineering, College of Biomedicine, City University of Hong Kong, Kowloon, Hong Kong SAR 999077, China., Chamberlin M; Department of Biomedical Engineering, College of Biomedicine, City University of Hong Kong, Kowloon, Hong Kong SAR 999077, China., Chen Z; Department of Mechanical Engineering, City University of Hong Kong, Kowloon, Hong Kong SAR 999077, China., Li J; Department of Neuroscience, College of Biomedicine, City University of Hong Kong, Kowloon, Hong Kong SAR 999077, China., Gao Y; Department of Biomedical Engineering, College of Biomedicine, City University of Hong Kong, Kowloon, Hong Kong SAR 999077, China., Guo F; Department of Biomedical Engineering, College of Biomedicine, City University of Hong Kong, Kowloon, Hong Kong SAR 999077, China., Ma Y; Department of Biomedical Engineering, College of Biomedicine, City University of Hong Kong, Kowloon, Hong Kong SAR 999077, China., Wei X; Department of Material Science and Engineering, City University of Hong Kong, Kowloon, Hong Kong SAR 999077, China., Luo X; Department of Biomedical Engineering, College of Biomedicine, City University of Hong Kong, Kowloon, Hong Kong SAR 999077, China., Zhang W; Department of Medical Rehabilitation, Kowloon Hospital, Kowloon, Hong Kong SAR 999077, China., Qu J; Department of Biomedical Engineering, College of Biomedicine, City University of Hong Kong, Kowloon, Hong Kong SAR 999077, China., Wei D; Department of Chemistry, City University of Hong Kong, Kowloon, Hong Kong SAR 999077, China., Zhu G; Department of Chemistry, City University of Hong Kong, Kowloon, Hong Kong SAR 999077, China., Wang F; Department of Material Science and Engineering, City University of Hong Kong, Kowloon, Hong Kong SAR 999077, China., Zhang H; School of Biomedical Engineering & State Key Laboratory of Advanced Medical Materials and Devices, Shanghai Technology University, Shanghai 201210, China.; Shanghai Clinical Research and Trial Center, Shanghai 201210, China., Yu X; Department of Biomedical Engineering, College of Biomedicine, City University of Hong Kong, Kowloon, Hong Kong SAR 999077, China., Chen X; Department of Neuroscience, College of Biomedicine, City University of Hong Kong, Kowloon, Hong Kong SAR 999077, China., Yang Y; Department of Mechanical Engineering, City University of Hong Kong, Kowloon, Hong Kong SAR 999077, China., Shi P; Department of Biomedical Engineering, College of Biomedicine, City University of Hong Kong, Kowloon, Hong Kong SAR 999077, China.; Center of Super-Diamond and Advanced Films (COSDAF), City University of Hong Kong, Kowloon, Hong Kong SAR 999077, China.; Hong Kong Centre for Cerebro-Cardiovascular Health Engineering, Hong Kong Science Park, Hong Kong SAR 999077, China.; Shenzhen Research Institute, City University of Hong Kong, Shenzhen 518000, China.
Source: Science advances [Sci Adv] 2026 Jun 19; Vol. 12 (25), pp. eaee2752. Date of Electronic Publication: 2026 Jun 19.
Publication Type: Journal Article
Journal Info: Publisher: American Association for the Advancement of Science Country of Publication: United States NLM ID: 101653440 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 2375-2548 (Electronic) Linking ISSN: 23752548 NLM ISO Abbreviation: Sci Adv Subsets: MEDLINE
Database: MEDLINE Ultimate
Description
ISSN:2375-2548
DOI:10.1126/sciadv.aee2752