A multifunctional porous interface bridging 3D architected electronics with skin.

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Title: A multifunctional porous interface bridging 3D architected electronics with skin.
Authors: Shen Z; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China., Cheng X; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; Department of Materials Science and Engineering, National University of Singapore, Singapore 119276, Singapore., Luo X; Department of Orthopedics, Beijing Tsinghua Changgung Hospital, School of Clinical Medicine, Tsinghua University, Beijing 102218, P.R. China., Tang Z; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China., Hu X; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China., Zhang H; School of Materials Science and Engineering, University of Science and Technology Beijing 100083, P.R. China., Xiao Y; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China., Liu Q; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China., Xu S; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China., Liu Z; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China., Bo R; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China., Yao S; School of Materials Science and Engineering, University of Science and Technology Beijing 100083, P.R. China., Zhang F; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China., Zhang Y; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China.; Mechano-X Institute, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.
Source: Science advances [Sci Adv] 2026 Jul 10; Vol. 12 (28), pp. eaef0161. Date of Electronic Publication: 2026 Jul 08.
Publication Type: Journal Article
Journal Info: Publisher: American Association for the Advancement of Science Country of Publication: United States NLM ID: 101653440 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 2375-2548 (Electronic) Linking ISSN: 23752548 NLM ISO Abbreviation: Sci Adv Subsets: MEDLINE
Database: MEDLINE Ultimate
Description
ISSN:2375-2548
DOI:10.1126/sciadv.aef0161