A multifunctional porous interface bridging 3D architected electronics with skin.
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| Title: | A multifunctional porous interface bridging 3D architected electronics with skin. |
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| Authors: | Shen Z; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China., Cheng X; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; Department of Materials Science and Engineering, National University of Singapore, Singapore 119276, Singapore., Luo X; Department of Orthopedics, Beijing Tsinghua Changgung Hospital, School of Clinical Medicine, Tsinghua University, Beijing 102218, P.R. China., Tang Z; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China., Hu X; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China., Zhang H; School of Materials Science and Engineering, University of Science and Technology Beijing 100083, P.R. China., Xiao Y; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China., Liu Q; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China., Xu S; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China., Liu Z; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China., Bo R; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China., Yao S; School of Materials Science and Engineering, University of Science and Technology Beijing 100083, P.R. China., Zhang F; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China., Zhang Y; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China.; Mechano-X Institute, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China. |
| Source: | Science advances [Sci Adv] 2026 Jul 10; Vol. 12 (28), pp. eaef0161. Date of Electronic Publication: 2026 Jul 08. |
| Publication Type: | Journal Article |
| Journal Info: | Publisher: American Association for the Advancement of Science Country of Publication: United States NLM ID: 101653440 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 2375-2548 (Electronic) Linking ISSN: 23752548 NLM ISO Abbreviation: Sci Adv Subsets: MEDLINE |
| Database: | MEDLINE Ultimate |
| FullText | Text: Availability: 0 |
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| Header | DbId: mdl DbLabel: MEDLINE Ultimate An: 42418591 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: A multifunctional porous interface bridging 3D architected electronics with skin. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AU" term="%22Shen+Z%22">Shen Z</searchLink>; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China.<br /><searchLink fieldCode="AU" term="%22Cheng+X%22">Cheng X</searchLink>; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; Department of Materials Science and Engineering, National University of Singapore, Singapore 119276, Singapore.<br /><searchLink fieldCode="AU" term="%22Luo+X%22">Luo X</searchLink>; Department of Orthopedics, Beijing Tsinghua Changgung Hospital, School of Clinical Medicine, Tsinghua University, Beijing 102218, P.R. China.<br /><searchLink fieldCode="AU" term="%22Tang+Z%22">Tang Z</searchLink>; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China.<br /><searchLink fieldCode="AU" term="%22Hu+X%22">Hu X</searchLink>; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China.<br /><searchLink fieldCode="AU" term="%22Zhang+H%22">Zhang H</searchLink>; School of Materials Science and Engineering, University of Science and Technology Beijing 100083, P.R. China.<br /><searchLink fieldCode="AU" term="%22Xiao+Y%22">Xiao Y</searchLink>; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China.<br /><searchLink fieldCode="AU" term="%22Liu+Q%22">Liu Q</searchLink>; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China.<br /><searchLink fieldCode="AU" term="%22Xu+S%22">Xu S</searchLink>; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China.<br /><searchLink fieldCode="AU" term="%22Liu+Z%22">Liu Z</searchLink>; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China.<br /><searchLink fieldCode="AU" term="%22Bo+R%22">Bo R</searchLink>; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China.<br /><searchLink fieldCode="AU" term="%22Yao+S%22">Yao S</searchLink>; School of Materials Science and Engineering, University of Science and Technology Beijing 100083, P.R. China.<br /><searchLink fieldCode="AU" term="%22Zhang+F%22">Zhang F</searchLink>; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.<br /><searchLink fieldCode="AU" term="%22Zhang+Y%22">Zhang Y</searchLink>; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.; State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China.; Mechano-X Institute, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China. – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22101653440%22">Science advances</searchLink> [Sci Adv] 2026 Jul 10; Vol. 12 (28), pp. eaef0161. <i>Date of Electronic Publication: </i>2026 Jul 08. – Name: TypePub Label: Publication Type Group: TypPub Data: Journal Article – Name: TitleSource Label: Journal Info Group: Src Data: <i>Publisher: </i><searchLink fieldCode="PB" term="%22American+Association+for+the+Advancement+of+Science%22">American Association for the Advancement of Science </searchLink><i>Country of Publication: </i>United States <i>NLM ID: </i>101653440 <i>Publication Model: </i>Print-Electronic <i>Cited Medium: </i>Internet <i>ISSN: </i>2375-2548 (Electronic) <i>Linking ISSN: </i><searchLink fieldCode="IS" term="%2223752548%22">23752548 </searchLink><i>NLM ISO Abbreviation: </i>Sci Adv <i>Subsets: </i>MEDLINE |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=mdl&AN=42418591 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1126/sciadv.aef0161 Languages: – Code: eng Text: English PhysicalDescription: Pagination: StartPage: eaef0161 Titles: – TitleFull: A multifunctional porous interface bridging 3D architected electronics with skin. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Shen Z – PersonEntity: Name: NameFull: Cheng X – PersonEntity: Name: NameFull: Luo X – PersonEntity: Name: NameFull: Tang Z – PersonEntity: Name: NameFull: Hu X – PersonEntity: Name: NameFull: Zhang H – PersonEntity: Name: NameFull: Xiao Y – PersonEntity: Name: NameFull: Liu Q – PersonEntity: Name: NameFull: Xu S – PersonEntity: Name: NameFull: Liu Z – PersonEntity: Name: NameFull: Bo R – PersonEntity: Name: NameFull: Yao S – PersonEntity: Name: NameFull: Zhang F – PersonEntity: Name: NameFull: Zhang Y IsPartOfRelationships: – BibEntity: Dates: – D: 10 M: 07 Text: 2026 Jul 10 Type: published Y: 2026 Identifiers: – Type: issn-electronic Value: 2375-2548 Numbering: – Type: volume Value: 12 – Type: issue Value: 28 Titles: – TitleFull: Science advances Type: main |
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