View in EDS

Reversibly Stacked Monolithic 3D Integrated Circuits.

Saved in:
Bibliographic Details
Title: Reversibly Stacked Monolithic 3D Integrated Circuits.
Authors: Weng TT; Institute of Electronics, National Yang Ming Chiao Tung University, Hsinchu, Taiwan., Wang ST; Institute of Electronics, National Yang Ming Chiao Tung University, Hsinchu, Taiwan., Chang YC; Institute of Electronics, National Yang Ming Chiao Tung University, Hsinchu, Taiwan., Li KW; Institute of Electronics, National Yang Ming Chiao Tung University, Hsinchu, Taiwan., Chung CC; Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan., Lo CH; Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan., Tseng R; Institute of Electronics, National Yang Ming Chiao Tung University, Hsinchu, Taiwan., Chen SC; Institute of Electronics, National Yang Ming Chiao Tung University, Hsinchu, Taiwan., Chou TT; National Center for Instrumentation Research, National Institutes of Applied Research, Hsinchu, Taiwan., Hung TYT; Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan., Cheng CC; Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan., Radu IP; Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan., Chueh YL; Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan. ylchueh@mx.nthu.edu.tw.; College of Semiconductor Research, National Tsing-Hua University, Hsinchu, Taiwan. ylchueh@mx.nthu.edu.tw.; Department of Physics, National Sun Yat-sen University, Kaohsiung, Taiwan. ylchueh@mx.nthu.edu.tw.; Department of Materials Science and Engineering, Korea University, Seoul, Republic of Korea. ylchueh@mx.nthu.edu.tw., Lien DH; Institute of Electronics, National Yang Ming Chiao Tung University, Hsinchu, Taiwan. dhlien@nycu.edu.tw.
Source: Nature communications [Nat Commun] 2026 Jul 09. Date of Electronic Publication: 2026 Jul 09.
Publication Type: Journal Article
Journal Info: Publisher: Nature Pub. Group Country of Publication: England NLM ID: 101528555 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 2041-1723 (Electronic) Linking ISSN: 20411723 NLM ISO Abbreviation: Nat Commun Subsets: MEDLINE
Database: MEDLINE Ultimate
FullText Text:
  Availability: 0
Header DbId: mdl
DbLabel: MEDLINE Ultimate
An: 42425980
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Reversibly Stacked Monolithic 3D Integrated Circuits.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Weng+TT%22">Weng TT</searchLink>; Institute of Electronics, National Yang Ming Chiao Tung University, Hsinchu, Taiwan.<br /><searchLink fieldCode="AU" term="%22Wang+ST%22">Wang ST</searchLink>; Institute of Electronics, National Yang Ming Chiao Tung University, Hsinchu, Taiwan.<br /><searchLink fieldCode="AU" term="%22Chang+YC%22">Chang YC</searchLink>; Institute of Electronics, National Yang Ming Chiao Tung University, Hsinchu, Taiwan.<br /><searchLink fieldCode="AU" term="%22Li+KW%22">Li KW</searchLink>; Institute of Electronics, National Yang Ming Chiao Tung University, Hsinchu, Taiwan.<br /><searchLink fieldCode="AU" term="%22Chung+CC%22">Chung CC</searchLink>; Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan.<br /><searchLink fieldCode="AU" term="%22Lo+CH%22">Lo CH</searchLink>; Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan.<br /><searchLink fieldCode="AU" term="%22Tseng+R%22">Tseng R</searchLink>; Institute of Electronics, National Yang Ming Chiao Tung University, Hsinchu, Taiwan.<br /><searchLink fieldCode="AU" term="%22Chen+SC%22">Chen SC</searchLink>; Institute of Electronics, National Yang Ming Chiao Tung University, Hsinchu, Taiwan.<br /><searchLink fieldCode="AU" term="%22Chou+TT%22">Chou TT</searchLink>; National Center for Instrumentation Research, National Institutes of Applied Research, Hsinchu, Taiwan.<br /><searchLink fieldCode="AU" term="%22Hung+TYT%22">Hung TYT</searchLink>; Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan.<br /><searchLink fieldCode="AU" term="%22Cheng+CC%22">Cheng CC</searchLink>; Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan.<br /><searchLink fieldCode="AU" term="%22Radu+IP%22">Radu IP</searchLink>; Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan.<br /><searchLink fieldCode="AU" term="%22Chueh+YL%22">Chueh YL</searchLink>; Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan. ylchueh@mx.nthu.edu.tw.; College of Semiconductor Research, National Tsing-Hua University, Hsinchu, Taiwan. ylchueh@mx.nthu.edu.tw.; Department of Physics, National Sun Yat-sen University, Kaohsiung, Taiwan. ylchueh@mx.nthu.edu.tw.; Department of Materials Science and Engineering, Korea University, Seoul, Republic of Korea. ylchueh@mx.nthu.edu.tw.<br /><searchLink fieldCode="AU" term="%22Lien+DH%22">Lien DH</searchLink>; Institute of Electronics, National Yang Ming Chiao Tung University, Hsinchu, Taiwan. dhlien@nycu.edu.tw.
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22101528555%22">Nature communications</searchLink> [Nat Commun] 2026 Jul 09. <i>Date of Electronic Publication: </i>2026 Jul 09.
– Name: TypePub
  Label: Publication Type
  Group: TypPub
  Data: Journal Article
– Name: TitleSource
  Label: Journal Info
  Group: Src
  Data: <i>Publisher: </i><searchLink fieldCode="PB" term="%22Nature+Pub%2E+Group%22">Nature Pub. Group </searchLink><i>Country of Publication: </i>England <i>NLM ID: </i>101528555 <i>Publication Model: </i>Print-Electronic <i>Cited Medium: </i>Internet <i>ISSN: </i>2041-1723 (Electronic) <i>Linking ISSN: </i><searchLink fieldCode="IS" term="%2220411723%22">20411723 </searchLink><i>NLM ISO Abbreviation: </i>Nat Commun <i>Subsets: </i>MEDLINE
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=mdl&AN=42425980
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1038/s41467-026-75242-y
    Languages:
      – Code: eng
        Text: English
    Titles:
      – TitleFull: Reversibly Stacked Monolithic 3D Integrated Circuits.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Weng TT
      – PersonEntity:
          Name:
            NameFull: Wang ST
      – PersonEntity:
          Name:
            NameFull: Chang YC
      – PersonEntity:
          Name:
            NameFull: Li KW
      – PersonEntity:
          Name:
            NameFull: Chung CC
      – PersonEntity:
          Name:
            NameFull: Lo CH
      – PersonEntity:
          Name:
            NameFull: Tseng R
      – PersonEntity:
          Name:
            NameFull: Chen SC
      – PersonEntity:
          Name:
            NameFull: Chou TT
      – PersonEntity:
          Name:
            NameFull: Hung TYT
      – PersonEntity:
          Name:
            NameFull: Cheng CC
      – PersonEntity:
          Name:
            NameFull: Radu IP
      – PersonEntity:
          Name:
            NameFull: Chueh YL
      – PersonEntity:
          Name:
            NameFull: Lien DH
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 09
              M: 07
              Text: 2026 Jul 09
              Type: published
              Y: 2026
          Identifiers:
            – Type: issn-electronic
              Value: 2041-1723
          Titles:
            – TitleFull: Nature communications
              Type: main
ResultId 1