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Direct wafer bonding of amorphous or densified atomic layer deposited alumina thin films.

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Bibliographic Details
Title: Direct wafer bonding of amorphous or densified atomic layer deposited alumina thin films.
Authors: Beche, E., elodie.beche@cea.fr, Fournel, F., Larrey, V., Rieutord, F., Fillot, F.
Source: Microsystem Technologies; May2015, Vol. 21 Issue 5, p953-959, 7p
Database: Applied Science & Technology Source
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