A review on future novel interconnect and polymeric materials for cryogenic memory packaging.
Saved in:
| Title: | A review on future novel interconnect and polymeric materials for cryogenic memory packaging. |
|---|---|
| Authors: | Gan, C. L.1, clgan@micron.com, Huang, Chen Yu1, Zou, Yung Sheng1, Chung, Min Hua1, Takiar, Hem2 |
| Source: | Journal of Materials Science: Materials in Electronics; Oct2023, Vol. 34 Issue 29, p1-15, 15p |
| Database: | Applied Science & Technology Source |
|
Full text is not displayed to guests.
Login for full access.
|
|
Be the first to leave a comment!
