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Alloying effects in near-eutectic SnAg-Cu solder alloys for improved microstructural stability.

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Bibliographic Details
Title: Alloying effects in near-eutectic SnAg-Cu solder alloys for improved microstructural stability.
Authors: Anderson, I. E., Foley, J. C., Cook, B. A.
Source: Journal of Electronic Materials; September 2001, Vol. 30 Issue 9, p1050-1059, 10p
Database: Applied Science & Technology Source
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