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Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices.

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Bibliographic Details
Title: Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices.
Authors: Yu, Li Ming, Sur, Bang Han, Pyo, Kim Young
Source: Journal of Electronic Packaging; March 2004, Vol. 126 Issue 1, p22-25, 4p
Database: Applied Science & Technology Source
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