NONDESTRUCTIVE 3D X-RAY MICROSCOPY SPEEDS THROUGHPUT IN NEW FAILURE ANALYSIS WORKFLOWS.
Saved in:
| Title: | NONDESTRUCTIVE 3D X-RAY MICROSCOPY SPEEDS THROUGHPUT IN NEW FAILURE ANALYSIS WORKFLOWS. |
|---|---|
| Authors: | Hartfield, Cheryl1 cheryl.hartfield@zeiss.com |
| Source: | Electronic Device Failure Analysis. Nov2024, Vol. 26 Issue 4, p14-19. 6p. |
| Subjects: | Failure analysis, X-ray microscopy, High performance computing |
| Abstract: | The article focuses on the growing demand for high-performance computing (HPC) driven by artificial intelligence and machine learning, leading to complex packaging challenges. Topics include the rise of heterogeneous integration and chiplet architectures, the application of 3D x-ray microscopy for nondestructive failure analysis, and the integration of AI models to enhance fault detection and process validation. |
| Database: | Engineering Source |
Be the first to leave a comment!
