Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices.
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| Title: | Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices. |
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| Authors: | Bargiel S; Institut FEMTO-ST, CNRS, Université de Franche-Comté, F-25000 Besançon, France., Cogan J; Aix Marseille University, CNRS/IN2P3, CPPM, Marseille, France., Queste S; Institut FEMTO-ST, CNRS, Université de Franche-Comté, F-25000 Besançon, France., Oliveri S; Institut FEMTO-ST, CNRS, Université de Franche-Comté, F-25000 Besançon, France., Gauthier-Manuel L; Institut FEMTO-ST, CNRS, Université de Franche-Comté, F-25000 Besançon, France., Raschetti M; Institut FEMTO-ST, CNRS, Université de Franche-Comté, F-25000 Besançon, France., Leroy O; Aix Marseille University, CNRS/IN2P3, CPPM, Marseille, France., Beurthey S; Aix Marseille University, CNRS/IN2P3, CPPM, Marseille, France., Perrin-Terrin M; Aix Marseille University, CNRS/IN2P3, CPPM, Marseille, France. |
| Source: | Micromachines [Micromachines (Basel)] 2023 Jun 24; Vol. 14 (7). Date of Electronic Publication: 2023 Jun 24. |
| Publication Type: | Journal Article |
| Journal Info: | Publisher: MDPI Country of Publication: Switzerland NLM ID: 101640903 Publication Model: Electronic Cited Medium: Print ISSN: 2072-666X (Print) Linking ISSN: 2072666X NLM ISO Abbreviation: Micromachines (Basel) Subsets: PubMed not MEDLINE |
| Database: | MEDLINE Ultimate |
| FullText | Text: Availability: 0 |
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| Header | DbId: mdl DbLabel: MEDLINE Ultimate An: 37512608 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AU" term="%22Bargiel+S%22">Bargiel S</searchLink>; Institut FEMTO-ST, CNRS, Université de Franche-Comté, F-25000 Besançon, France.<br /><searchLink fieldCode="AU" term="%22Cogan+J%22">Cogan J</searchLink>; Aix Marseille University, CNRS/IN2P3, CPPM, Marseille, France.<br /><searchLink fieldCode="AU" term="%22Queste+S%22">Queste S</searchLink>; Institut FEMTO-ST, CNRS, Université de Franche-Comté, F-25000 Besançon, France.<br /><searchLink fieldCode="AU" term="%22Oliveri+S%22">Oliveri S</searchLink>; Institut FEMTO-ST, CNRS, Université de Franche-Comté, F-25000 Besançon, France.<br /><searchLink fieldCode="AU" term="%22Gauthier-Manuel+L%22">Gauthier-Manuel L</searchLink>; Institut FEMTO-ST, CNRS, Université de Franche-Comté, F-25000 Besançon, France.<br /><searchLink fieldCode="AU" term="%22Raschetti+M%22">Raschetti M</searchLink>; Institut FEMTO-ST, CNRS, Université de Franche-Comté, F-25000 Besançon, France.<br /><searchLink fieldCode="AU" term="%22Leroy+O%22">Leroy O</searchLink>; Aix Marseille University, CNRS/IN2P3, CPPM, Marseille, France.<br /><searchLink fieldCode="AU" term="%22Beurthey+S%22">Beurthey S</searchLink>; Aix Marseille University, CNRS/IN2P3, CPPM, Marseille, France.<br /><searchLink fieldCode="AU" term="%22Perrin-Terrin+M%22">Perrin-Terrin M</searchLink>; Aix Marseille University, CNRS/IN2P3, CPPM, Marseille, France. – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22101640903%22">Micromachines</searchLink> [Micromachines (Basel)] 2023 Jun 24; Vol. 14 (7). <i>Date of Electronic Publication: </i>2023 Jun 24. – Name: TypePub Label: Publication Type Group: TypPub Data: Journal Article – Name: TitleSource Label: Journal Info Group: Src Data: <i>Publisher: </i><searchLink fieldCode="PB" term="%22MDPI%22">MDPI </searchLink><i>Country of Publication: </i>Switzerland <i>NLM ID: </i>101640903 <i>Publication Model: </i>Electronic <i>Cited Medium: </i>Print <i>ISSN: </i>2072-666X (Print) <i>Linking ISSN: </i><searchLink fieldCode="IS" term="%222072666X%22">2072666X </searchLink><i>NLM ISO Abbreviation: </i>Micromachines (Basel) <i>Subsets: </i>PubMed not MEDLINE |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=mdl&AN=37512608 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.3390/mi14071297 Languages: – Code: eng Text: English Titles: – TitleFull: Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Bargiel S – PersonEntity: Name: NameFull: Cogan J – PersonEntity: Name: NameFull: Queste S – PersonEntity: Name: NameFull: Oliveri S – PersonEntity: Name: NameFull: Gauthier-Manuel L – PersonEntity: Name: NameFull: Raschetti M – PersonEntity: Name: NameFull: Leroy O – PersonEntity: Name: NameFull: Beurthey S – PersonEntity: Name: NameFull: Perrin-Terrin M IsPartOfRelationships: – BibEntity: Dates: – D: 24 M: 06 Text: 2023 Jun 24 Type: published Y: 2023 Identifiers: – Type: issn-print Value: 2072-666X Numbering: – Type: volume Value: 14 – Type: issue Value: 7 Titles: – TitleFull: Micromachines Type: main |
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